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TECHNOLOGY |
Product Offering
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Product types
DS
4L-12L
Semi-flex (assembly flex)
Properties, wiring density in volume production
Board thickness 0.6 – 3.5 mm
Maximum copper base 105 mm (3 Oz)
Minimum inner layer thickness 125 mm (5 mil)
Inner layer line/space 125/125 mm (5/5 mil)
Outer layer line/space 125/175 mm (5/7 mil)
Minimum hole size 0.3 mm (12 mil)
Aspect ratio 6
Annular ring 150 mm (6 mil)
Solder mask opening 75 mm (3 mil)
Surface finishes
Immersion gold (ENIG)
Immersion silver (Imm. Ag)
Immersion tin (Imm. Sn)
Organic solderability preservative (OSP)
Hot air leveling (HAL)
Electrolytic gold
Carbon printing |
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